Manual d'usuari del mòdul LoRa SX1262 de la sèrie EBYTE E22P

1. Introducció

The EBYTE E22P Series LoRa Modules are high-performance wireless communication modules based on the SEMTECH SX1262 RF transceiver chip. These modules are designed for long-distance transmission with low power consumption, offering enhanced efficiency, faster speeds, and a compact size. They feature built-in PA (Power Amplificador), LNA (baix soroll Amplifier), SWA (Switching Amplifier), and ESD protection, making them suitable for various industrial and IoT applications requiring stable and anti-interference communication.

2. Característiques clau

Chipset: SEMTECH SX1262 RF transceiver module.
Bandes de freqüència: Available in 868MHz (E22P-868M30S) and 915MHz (E22P-915M30S) variants.
Alt rendiment: Utilizes new SX1262/SX1268 chips for full performance upgrade, offering higher efficiency, longer distance, faster speed, and smaller size.
Llarga distància de comunicació: Capable of up to 12km transmission distance under clear and open conditions with optimal antenna configuration.
Stable and Anti-interference: Built-in RF front-end module, power amplifier, baix soroll amplifier, surface acoustic wave filter, and ceramic filter improve out-of-band spurious suppression and anti-interference capabilities.
High Precision Oscillator: Adopts a 32MHz high-precision active temperature-compensated crystal oscillator (TCXO) to ensure accurate and stable frequency across a wide temperature range (-40°C to +85°C).
Potència de sortida: Up to 30dBm (approximately 1W) transmit power.
Interfície: SPI (Serial Peripheral Interface).
Protecció ESD: Integrated ESD protection design.
Mida compacta: Dimensions of 38.5mm x 24mm, suitable for applications with high volume requirements.
Opcions d'antena: Admet IPEX i St.amp Holes for flexible antenna integration.

EBYTE E22P LoRa Module performance upgrade with SX1262 chip — Figure 1: Full performance upgrade with SX1262/SX1268 chips, highlighting benefits like low power consumption, long distance, higher efficiency, faster speed, and smaller size.

EBYTE E22P LoRa Module long-distance transmission and anti-interference — Figure 2: Long-distance transmission communication is stable and has strong anti-interference ability due to built-in RF front-end module, power amplifier, LNA, SAW filter, and ceramic filter.

EBYTE E22P LoRa Module 12km communication distance — Figure 3: Measured communication distance of 12km under clear and open conditions, with maximum power and 2.5 kbps air speed, using a 5 dBi suction cup antenna 2 meters high.

EBYTE E22P LoRa Module active temperature compensated crystal oscillator — Figure 4: Comparison showing the benefits of an active temperature compensated crystal oscillator for stable and accurate frequency, especially across temperature variations.

3. Variants de producte

The E22P series offers modules optimized for different frequency bands:

E22P-868M30S: Operates in the 868MHz frequency band.
E22P-915M30S: Operates in the 915MHz frequency band.

Both variants share the same core features and dimensions, differing primarily in their operating frequency to comply with regional regulations and application requirements.

EBYTE E22P-868M30S and E22P-915M30S LoRa Module dimensions — Figure 5: Dimensions of the E22P-868M30S and E22P-915M30S modules, both measuring 38.5mm x 24mm.

EBYTE E22P-915M30S and E22P-868M30S LoRa Modules with SX1262 chip — Figure 6: E22P-915M30S and E22P-868M30S LoRa modules, highlighting the SEMTECH SX1262 RF transceiver module.

4. Especificacions

4.1. Paràmetres generals

Paràmetres principals	E22P-868M30S	E22P-915M30S
Banda de freqüència de funcionament	863.3-873.3 MHz	902-928 MHz
Xip RF	SX1262
Freqüència de cristall	32MHz (High-precision active temperature compensated crystal oscillator)
Transmissió de potència	30dBm (Maximum power, about 1W)
Distància de comunicació	12000m (Max, with 5dBi antenna, 2m height)
Interfície de comunicació	SPI
Tarifa aèria	0.018-300 kbps
Subministrament Voltage (V)	2.5-5.5V (DC 3.3-5.5V)
Emission Current (mA)	610	640
Receiving Sensitivity (dBm)	-150
Tipus d'antena	IPEX/Stamp Forats
Pes del producte (g)	4.9 ± 0.1 g
Encapsulation Interface	Pegat
Corrent del son	3uA

EBYTE E22P LoRa Module Product Parameters Table — Figure 7: Detailed product parameters for E22P-868M30S and E22P-915M30S modules.

4.2. Definicions de pins

Número de sèrie	Nom del pin	Tipus de pin	Pin Propòsit
1	GND	-	Cable de terra, connectat a la terra de referència de potència
2	GND	-	Cable de terra, connectat a la terra de referència de potència
3	GND	-	Cable de terra, connectat a la terra de referència de potència
4	GND	-	Cable de terra, connectat a la terra de referència de potència
5	GND	-	Cable de terra, connectat a la terra de referència de potència
6	EN	Entrada	RF enable control pin, connected to external MCU IO, high level is valid
7	T/R CTRL	Entrada/sortida	RF transmission and reception control pins, high level for transmission, low level for reception, connected to external microcontroller IO or DIO2
8	DIO2	Entrada/sortida	Configurable general IO port
9	VCC	-	Power supply, range 3.3 ~ 5.5V (it is recommended to add external ceramic filter capacitor)
10	VCC	-	Power supply, range 3.3 ~ 5.5V (it is recommended to add external ceramic filter capacitor)
11	GND	-	Cable de terra, connectat a la terra de referència de potència
12	GND	-	Cable de terra, connectat a la terra de referència de potència
13	DIO1	Entrada/sortida	Configurable general IO port
14	OCUPAT	Sortida	S'utilitza per a la indicació d'estat
15	NRST	Entrada	Chip reset trigger input pin, low level is valid
16	MISO	Sortida	Pin de sortida de dades SPI
17	Extensió MOSI	Entrada	Pin d'entrada de dades SPI
18	SCK	Entrada	Pin d'entrada del rellotge SPI
19	NSS	Entrada	Pin de selecció de xip del mòdul, utilitzat per iniciar una comunicació SPI
20	GND	-	Cable de terra, connectat a la terra de referència de potència
21	ANT	-	Interfície d'antena, stamp forat (impedància característica de 50Ω)
22	GND	-	Cable de terra, connectat a la terra de referència de potència

EBYTE E22P LoRa Module Pin Definitions Diagram — Figure 8: Pin definitions and layout for the E22P-868M30S / E22P-915M30S modules.

4.3. RF Output Power Comparison

E22P-868M30S RF output power comparison chart — Figure 9: RF output power comparison curve for E22P-868M30S, showing real output (dBm) versus set power (dBm) across different frequencies (873MHz, 868MHz, 863MHz).

E22P-915M30S RF output power comparison chart — Figure 10: RF output power comparison curve for E22P-915M30S, showing real output (dBm) versus set power (dBm) across different frequencies (928MHz, 915MHz, 902MHz).

5. Configuració

5.1. Module Integration

The E22P modules are designed for surface-mount (SMD) integration. Ensure proper soldering techniques are used to avoid damage. Connect the module to your microcontroller (MCU) using the SPI interface and relevant control pins as defined in Section 4.2.

Recommended circuit diagram for E22P LoRa Module to MCU connection — Figure 11: Recommended circuit diagram illustrating the connection between the E22P-xxxMxxS module and a microcontroller (MCU) via SPI and control pins.

5.2. Connexió d'antena

The module supports both IPEX and stamp hole antenna interfaces. Choose an appropriate 50Ω antenna for your application and frequency band (868MHz or 915MHz). For optimal performance, ensure the antenna is positioned correctly and has a clear line of sight.

EBYTE E22P LoRa Module dual antenna option and high-quality components — Figure 12: The module offers dual antenna options for flexibility and uses high-quality components like Wurth wirewound inductors for better filtering.

5.3. Font d'alimentació

Provide a stable DC power supply within the range of 2.5V to 5.5V. It is highly recommended to add external ceramic filter capacitors to the VCC pins to ensure stable power delivery and minimize noise.

5.4. Offline Test Evaluation Kit (Optional)

For quick evaluation and testing, an Offline Test Evaluation Kit is available. This kit includes a pre-welded E22P module, glue stick antennas (868M/915M), 2*10PIN headers, and a Type-C adapter cable. It is recommended to order two pieces of the kit for easy sending and receiving tests.

EBYTE E22P LoRa Module Offline Test Evaluation Kit — Figure 13: The Offline Test Evaluation Kit features an OLED display, LED indicator, control buttons (OK, UP, DOWN, Back), and a Type-C interface for quick testing.

EBYTE E22P LoRa Module Offline Test Evaluation Kit Checklist — Figure 14: Checklist for the Offline Test Evaluation Kit, including the E22P Offline Test Board (with soldered module), glue stick antennas, 2*10PIN headers, and a Type-C adapter cable.

6. Instruccions de funcionament

6.1. Basic Operation with Test Kit

If using the Offline Test Evaluation Kit:

Connect the Type-C adapter cable to the kit and a power source (e.g., power bank or computer).
The OLED display will show the current mode (e.g., Home, Setting, Tx Mode, Rx Mode, Version).
Use the 'OK', 'UP', and 'DOWN' buttons to navigate menus and configure parameters. The 'Back' button (Buzzer) can be used to return to previous menus.
The LED indicator provides visual feedback on module status.
For data transmission tests, configure one kit as a transmitter and another as a receiver.

6.2. Data Transfer Example

When performing data transfer tests with two evaluation kits:

Configure the number of times to send data on the transmitting module.
The receiving module can display real-time data such as channel, rate, power, total transmissions (Tx Total), current receptions (Current), lost packets (Lost), and packet loss rate (Lost Pkt %).

EBYTE E22P LoRa Module data transfer example with transmitter and receiver — Figure 15: Data transfer example showing two E22P test kits configured as a transmitter and receiver, displaying real-time communication parameters on their OLED screens.

6.3. Desenvolupament de programari

The Offline Test Evaluation Kit includes an onboard master control STM32E103C8T6, which supports secondary development. Users can develop custom firmware to control the LoRa module and integrate it into their specific applications.

7. Manteniment

Protecció ESD: Always handle the module with proper electrostatic discharge (ESD) precautions to prevent damage to sensitive components.
Neteja: Keep the module clean and free from dust, moisture, and corrosive substances.
Temperatura: Operate the module within its specified temperature range (-40°C to +85°C). Avoid extreme temperatures that can affect performance and longevity.
Danys físics: Avoid physical stress or impact to the module. Ensure proper mounting to prevent vibrations or accidental disconnections.

8. Solució De Problemes

Sense comunicació:
- Check all power connections (VCC, GND) and ensure they are stable and within the specified voltage gamma.
- Verify SPI connections (MISO, MOSI, SCK, NSS) are correct and securely attached.
- Ensure the EN pin is high for RF operation.
- Check the T/R CTRL pin for correct transmission/reception mode.
- Confirm antenna is properly connected and matched to the module's frequency.
Abast/senyal deficient:
- Ensure antennas are correctly installed and have a clear line of sight.
- Check for environmental interference (e.g., other wireless devices, metal obstructions).
- Verify transmit power settings are at the desired level.
- Ensure both modules are operating on the same frequency and with compatible LoRa parameters (e.g., spreading factor, bandwidth).
El mòdul no respon:
- Check the NRST pin. A low level on this pin will reset the chip.
- Verify the power supply is stable and sufficient.
Problemes de programari:
- Double-check your SPI communication code and register configurations.
- Refer to the SX1262 datasheet and EBYTE's documentation for detailed register maps and programming guides.

9. Consells d'usuari

Selecció d'antena: For maximum range, use a high-gain antenna (e.g., 5dBi) and position it as high as possible with minimal obstructions.
Filtratge de potència: Always include ceramic filter capacitors on the VCC lines close to the module to ensure clean power and prevent noise from affecting RF performance.
Precaucions ESD: When handling the module, especially during installation or antenna connection, use an anti-static wrist strap and work on an ESD-safe surface.
Prova: When setting up a new communication link, start with short distances and gradually increase the range while monitoring signal quality.
Firmware Development: Leverage the STM32E103C8T6 on the evaluation kit for custom firmware development to tailor the module's behavior to your specific application needs.

10. Garantia i Suport

For detailed warranty information, technical support, and additional resources, please refer to the official EBYTE website or contact their customer service. Firmware updates and further documentation may also be available on the manufacturer's product page.

Descarregar files: https://www.cdebyte.com/product_serch/E22P/1/

Vídeo 1: Producte acabatview of the EBYTE E22P LoRa Module, showcasing its physical appearance and key features.

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